Precision Engineering
Wafer Cutting Machine G-ACM
A precision cutting system delivers exact dimensional control for wafer products while maximizing production efficiency. The flexible configuration options ensure perfect integration with existing lines, while multiple cutting technologies accommodate diverse product requirements. The food-grade stainless steel construction ensures hygiene compliance while the central drive system provides reliable, consistent performance for superior product quality.
Customizable capacity & various single or tandem cutting options (Up to 13 cuts/min)
Central feeding system with integrated stacking up to 70 mm & precise positioning
Multiple cutting technologies (blade, wire, rotating saw) for diverse products
Central drive system & optimized product flow design for consistent operation
Stainless steel construction & optional waste removal conveyor for a clean environment
